Xecs Call 6 2026: Eureka funding for electronic components and systems projects
Xecs Call 6 backs international R&D projects on chips and electronic systems with national public funding. Project outlines are due 21 January 2027.
Xecs Call 6 is the yearly open call of Xecs, the Eureka Cluster for electronic components and systems. AENEAS runs the programme. The call supports collaborative research and innovation projects across the whole value chain of electronic components and systems.
Xecs does not pay grants itself. Projects that win the Xecs label are funded by national and regional public authorities, each under its own rules. Countries that have said they support the annual call include Austria, Belgium, Canada, Chile, Finland, France, Hungary, Ireland, Israel, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Poland, Portugal, Singapore, Slovakia, South Africa, South Korea, Spain, Türkiye and the United Kingdom. The page gives no funding amounts.
A consortium needs at least two independent legal entities from two Eureka countries, and Xecs recommends partners from at least three countries. No partner or country may cover more than 70% of the budget. The consortium must cover at least an essential part of the value chain. The project must be industry driven, develop an innovative product, process or service, and have a civilian purpose.
The call has two stages, and all documents must be in English. Project outlines are due on 21 January 2027 at 17:00 CET in the Xecs Project Zone. Consortia that are invited to continue submit a full project proposal by 15 April 2027.
Xecs advises applicants to talk to their national public authority contacts early, because some countries have their own funding priorities.
Quick answers
Does the Xecs label guarantee funding?
No. Xecs says the label does not automatically mean funding. Each partner must apply for funding in its own country, under that country's rules.
Which topics can a project cover?
Call 6 is a bottom up call. Projects can come from any area of the 2026 Strategic Research and Innovation Agenda for electronic components and systems, which runs from chips up to full system integration.