Build the Autodesk University 2027 Product
A Hackster design challenge to create the official Autodesk University 2027 product, open until December 21, 2026. The winning concept is manufactured for about 750 attendees.
Build the Autodesk University 2027 Product is a design challenge run by Hackster.io, an Avnet community, together with Autodesk, Arduino, Qualcomm and PCBWay. It asks developers, engineers and makers to design the next official product for Autodesk University 2027.
Entries should be connected devices that improve how people interact with themselves, their environment or other people. The organizers name wearable technology, assistive devices, AI powered accessories and compact productivity tools as examples. Entries may use manufacturing approaches such as injection molding, 3D printing, CNC machining and custom PCB design.
Selected participants receive hardware support to develop their concepts with Autodesk Fusion and the Arduino UNO Q, plus funding from PCBWay. The winning concept will be manufactured and distributed to approximately 750 attendees at Autodesk University 2027. Beyond the grand prize for Best AU 2027 Product Concept, awards go to Best Fusion Electronics Design and Best Use of the Arduino UNO Q.
Projects are judged on innovation, technical execution, creativity and overall production potential. The challenge launched on August 12, 2026. According to the Hackster contests page, participation is open until December 21, 2026. Register on the Hackster contest page.